Use liquid gasification latent heat to check the tin and solder joints on the circuit board?
How to use the latent heat of vaporization of liquid to carry out tin on circuit board and solder joint inspection of circuit board
How to use the latent heat of vaporization of liquid to carry out tin on circuit board and solder joint inspection of circuit board
The above mainly introduces the manufacturing process of double-sided FPC
The circuit board manufacturer and circuit board designer will explain to you the influence of lead-free technology on circuit board manufacturing
Understand PCB design, multilayer PCB and PCB manufacturing in PCB industryUnderstand pcb circuit board proofing and cutting size
The circuit board manufacturer and the circuit board designer explain to you how the dew point of the production environment affects the welding of circuit boards
The circuit board manufacturer and circuit board designer explain the factors that cause poor contact of the test probe after welding and how to avoid it
The circuit board manufacturer and circuit board designer will explain how to select the appropriate solder paste mixer.
The circuit board manufacturer and circuit board designer explain the standards and techniques for wave soldering temperature setting
The circuit board manufacturer and circuit board designer explain to you what qualities wave soldering technicians need to have?
The assembly of both cartridge components and surface assembly components is called hybrid assembly, referred to as mixed assembly, and the assembly using all surface assembly components is called full surface mount. PCBA assembly method and process flow
Understand PCB design, PCB wiring and PCB manufacturing in PCB industryInterpret the PCBlayout design wiring layout in the circuit board
The circuit board manufacturer and circuit board designer will explain the use method and specification of the solder paste thickness gauge.