Calculation Method of Board Warpage of Flexible Circuit Board and Process of SMT OEM

Calculation Method of board Warpage of Flexible Circuit Board and Process of SMT OEM

PCB manufacturers, PCB designers and PCBA manufacturers will explain the calculation method of the board warpage of flexible circuit boards and the process of OEM and material replacement.

Each process has its own inspection standard, and Flexible circuit board is no exception. As the core process of electronIC equipment, flexible circuit board has many and strict inspection standards, and the calculation of warpage is one of them. Warpage, as the name implies, refers to whether the flexible circuit board printed board is flat and can be perfectly inserted into the holes and surface mount pads of the board.

Warpage usually refers to the surface distortion of a plastic part that is not formed according to the designed shape. There are many factors affecting the warpage, so we must pay great attention to it during production. Every minor error may cause the whole circuit board to be scrapped. How to calculate the warpage of FPC? Now let's introduce it to you.

Calculation formula for warpage of flexible circuit board:

Warpage=single angle warping height/(diagonal length of flexible circuit board * 2) * 100%

In the automatic insertion line, if the printed board is not flat, it will cause inaccurate positioning, or even damage the automatic insertion machine. If the component pins are bent after the board is instalLED with components and soldered, it is very difficult to cut them flat and tidy. This will eventually lead to the failure of installing the flexible circuit board into the chassis or the socket inside the machine, which is equivalent to scrapping a circuit board. It can be seen that manufacturers are very distressed if they encounter the warpage of the circuit board, so the requirements on the warpage of the flexible circuit board are increasingly strict.

This is the end of today's SMAll science popularization of flexible circuit boards. I hope it can provide some help for your future life, and let you have more profound understanding of flexible circuit boards!

soft board patch OEM process

In order to better understand the OEM process of soft board patch, let's take a look at the OEM process of soft board patch today.

The processing process control is an indispensable part of the production process of processing soft board patch. It has a variety of processing methods, such as the quota management of solder paste, patch adhesive, component loss, etc., and standardized control of technical parameters, processes, personnel, equipment, materials, processing testing, workshop environment and other factors. These operation methods and processing methods are very helpful to improve the overall quality of SMT chip processing and soft board chip processing. In the process of controlling the processing, we can find and screen out the defective products at the first time and put them off the production line, so that such unqualified products cannot enter the next processing link. An excellent processing factory should strictly control the product quality and put quality management first.

Here is a brief introduction to the process control.

1、 Product batch management

The control procedure for nonconforming products shall clearly specify the isolation, identification, record, review and treatment of nonconforming products. Generally, SMT patch shall not be repaired more than three times, and components shall not be repaired more than two times.

2、 Maintenance of processing equipment

The key equipment shall be regularly inspected by full-time maintenance personnel to keep the equipment in good condition. The equipment status shall be tracked and monitored to find problems in a timely manner, take corrective and preventive measures, and maintain and repair the equipment in a timely manner.

3、 Production environment

1. The water and electricity supply shall meet the processing standards and be stable;

2. The temperature, humidity, noise and cleanliness shall meet the requirements of soft board patch processing;

3. Strict anti-static system is required during the processing of soft board patch;

4. The access system, equipment operation procedures and process disciplines of the production workshop shall be strictly implemented according to the requirements.

4、 Production

The site shall be reasonably fixed and correctly MARKed; Materials and in-process products in the warehouse shall be stored by category, stacked neatly, and the standing book shall be consistent.

This is a brief introduction to the process control of the OEM and substitute material processing of soft board mountings. There is no shortage of words such as "strict" and "neat". The frequent use of these words means that the production control of the OEM and substitute material processing of soft board mountings is strict and high standard. At the same time, we hope that readers can have a preliminary understanding of the process control. PCB manufacturers, PCB designers and PCBA manufacturers will explain the calculation method of the board warpage of flexible circuit boards and the process of OEM and material replacement.