What is the method for testing the push, resistance and tension standards of PCBA welded parts?

What is the method for testing the push, resistance and tension standards of PCBA welded parts?

At present, PCBA is the most popular technology and processing technology in the electronIC component assembly and manufacturing industry. It is a kind of power circuit assembly technology that installs the surface assembLED electronIC components that are sorted and packaged by the drainage matrix without feet or short wires or balls on the surface of the pcb circuit board or other base steel plates. It is assembled by electric welding in many ways according to the reflow welding furnace or immersion welding. In order to analyze the cause of component falling, the compressive strength of PCBA electric welding must be analyzed. What is the push-pull force of components? This article introduces the push-pull force specifications and relative push-pull force test standards of various components in detail.

1. Component name Test equipment Test standard Investment promotion specification (Kgf) chip0402 Thrust meter:

① Remove other parts that hinder the edges of 0402 parts;

② Use the thrust meter to zero the instruments and equipment, and carry out investment attraction inspection with a visual angle of ≤ 30 degrees; ③ Check whether components are desoldered, and record the use value of components desoldered; ≥ 0.65Kgf reaches the standard.

2. CHIP0603 thrust meter:

① Remove other parts blocking the edges of 0603 parts;

② Use the thrust meter to zero the instruments and equipment, and carry out thrust detection with a visual angle of ≤ 30 degrees; ③ Check whether the components are desoldered, and record the standard value of component desoldering; ≥ 1 and 2Kgf meet the standard. The relative density of PCBA assembly is high, the size of electronic equipment is SMAll, and the weight is relatively light. The volume and net weight of patch type components can only be about 1/10 of that of traditional plug-in components. Generally, after SMT is selected, the volume of electronic equipment decreases by 40%~60%, and the net weight decreases by 60%~80%.

3.20CHIP0805 thrust meter

① Remove other parts blocking the edges of 0805 parts;

② Use the thrust meter to zero the instruments and equipment, and carry out thrust detection with a visual angle of ≤ 30 degrees; ③ Check whether components are desoldered, and record the use value of components desoldered; ≥ 2 and 30Kgf are up to standard.

4.30CHIP1206 thrust meter

① Remove other parts that hinder the edge of 1206 parts;

② Use the thrust meter to zero the instruments and equipment, and carry out thrust detection with a visual angle of ≤ 30 degrees; ③ Check whether the parts are desoldered, and record the value of poor contact of the parts; ≥ 3, 00Kgf reaches the standard.

5.0 SIM card connector thrust meter:

① Remove other parts that hinder the edges of the SIM card parts of the mobile phone;

② The instrument and equipment shall be zeroed with a thrust gauge, and thrust detection shall be carried out with a visual angle of ≤ 30 degrees; ③ Check whether the components are damaged and record the value of component cracking; 4. ≥ 5, 00Kgf up to standard.

PCB manufacturers, PCB designers, and PCBA manufacturers will explain to you the methods of testing the push, resistance, and tension standards of PCBA welding components.