Application Advantages and Test Analysis of FPC Soft Board in Electronic Products

FPC soft board, also known as flexible printed board, can be widely used in communICation products, computers, consumer electronics, CAMeras, automobiles and other fields. Its functions can be divided into lead lines, printed circuits, printers, and multi-functional integration systems. Because the traditional hard board material is relatively hard, it cannot adapt to the development of miniaturization, high-density and lightweight of electronic products. FPC soft board is not only a Flexible circuit board, but also an important material to connect into a three-dimensional circuit structure, so it is very popular in the design of electronic products.

Among consumer electronic products, SMArt phones have a large demand for FPC soft boards, and batteries, screens, camera modules and other hardware need to use FPC soft boards. FPC soft board has the following advantages:

1. With high flexibility, it can reduce the product volume and change the shape according to the space limit

2. Stereoscopic wiring and folding winding are available, which is conducive to product design and can reduce assembly time and errors

3. The chEMIcal property is stable, which can improve the service life of the product, prevent electrostatic interference, and is safe and reliable

4. It has the characteristics of high and low temperature resistance, flame resistance, good heat dissipation, multiple functions and low cost

5. Be able to realize miniaturization, thinness and lightweight, conform to the development characteristics of electronic products, and achieve the integration of component devices and wire connection

In the era of full screen smart phones, the application of LCD/OLED and AMOLED display panels, virtual keys instead of physical keys, and fingerprint identification schemes under the screen have greatly increased the use of FPC softboards in mobile phones. FPC soft board saves the internal space of smart phone to a certain extent, and makes the internal assembly and processing of mobile phone more flexible. With the release of folding screen mobile phones, the use of FPC soft boards increases with the expansion of folding screen screens. The use and value of FPC soft boards in a single mobile phone are growing.

The newly emerging intelligent wearable devices, such as smart bracelets, smart watches, and smart glasses, also need to use FPC soft boards. The number of FPC soft boards in VR glasses has reached nine. The small and flexible characteristics of FPC soft boards are highly consistent with intelligent wearable devices. The development of wearable products will also greatly boost the demand for FPC soft boards, making the growth rate of FPC soft boards faster.

FPC soft board has excellent characteristics and broad MARKet development space. Testing the quality, material and performance of FPC soft board is conducive to improving the manufacturing technology of FPC soft board and reducing material loss and environmental pollution. Some necessary equipment is needed during the test. For example, the high current spring micro needle module that can transmit current can establish a stable connection for FPC soft board test.

The basic test standards of FPC soft board include: 1. appearance of substrate film surface and covering layer; 2. Deviation between the connecting disc and the covering layer, flow seepage of the adhesive and the covering layer, and discoloration of the conductor under the covering layer; 3. Whether the temperature resistance, humidity resistance, voltage resistance, bending resistance and welding resistance meet the requirements; 4. Poor electroplating combination, coating leakage, etc.

During the voltage withstand test of FPC, it is necessary to connect the circuit to test its current transmission capacity and voltage bearing capacity. As the connection module, the high current spring chip micro needle module can transmit and conduct the current within the range of 1-50A, with strong over-current capacity and stable connectivity. The high current spring micro needle module after gold plating process not only has strong conductivity, but also has a reliable response in the field of small pitch, which can adapt to the pitch value between 0.15 mm and 0.4 mm. The contact is stable without pin jamming, and the average service life can reach more than 20 w times. It does not need to be replaced frequently during testing, which effectively saves time and material costs. The high current elastic sheet micro needle module has low manufacturing difficulty, fast delivery time, long service life and stable performance. It can effectively improve the testing efficiency and increase the output of FPC soft boards in FPC soft board testing.